Phones
Samsung Galaxy A15 5G packs MediaTek Dimensity 6100+ chipset, Android 14
Benchmark listing reveals that Samsung’s upcoming Galaxy A15 5G packs MediaTek Dimensity 6100+ chipset. The specifications of this processor are quite identical to the Helio G99, but it brings 5G network support, making it superior.
Samsung will unveil the Galaxy A15 soon, and an announcement might arrive before the S24 series. It will be available in both 4G and 5G network variants, depending on the market. To be noted, it will be a sequel to the A14, which is the best-selling Android phone in 2023.
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Apart from this, the Galaxy A15’s Geekbench listing reveals that the device has 4GB of RAM, with an 8GB variant rumored as well. In addition, the device runs Android 14 out of the box, probably, it will be shipped with the company’s One UI 6.0 skin on top.
Samsung will unveil the next-generation foldable phones in the second half of the next year. Meanwhile, a new report reveals that the company is planning a significant upgrade for next year’s Galaxy Z handsets.
According to the info, Samsung will change the screen ratio with the Galaxy Z Fold 6. A blog post on Naver reveals that the next Fold will look different than its predecessor, the Galaxy Z Fold 5.
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Samsung’s Galaxy Z Fold 6 is reportedly codenamed Q6. As Chinese foldables look more premium, the next Galaxy Z Fold will also follow suit with a lighter feel and a useful cover screen.
While aspect ratio for both inner and cover screens is believed to be changed, the report doesn’t say whether it will be wider than the the Galaxy Z Fold 5. As for the Galaxy Z Flip 6, Samsung is said to bring reduced inner screen bezels.
Qualcomm has been working on the development of the Oryon CPU, which will debut with the Snapdragon 8 Gen 4 next year. In a new Weibo post, tipster Digital Chat Station revealed that the company’s next Snapdragon chipset is codenamed SUN.
The Snapdragon 8 Gen 4 featuring Oryon CPU features 2+6 architecture. Notably, TSMC is said to produce the chipset on its cutting-edge 3nm fabrication process. The source added that Qualcomm’s Oryon architecture has significantly improved, posing a threat to Apple.
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Apple’s Bionic chipsets have always maintained an edge over its Android rivals, especially the Snapdragon 8 series chips. This year’s A17 Pro is built on a 3nm process, while the next Snapdragon will make use of TSMC’s enhanced 3nm process.
More on Snapdragon 8 Gen 4:
- Snapdragon 8 Gen 4 specs leaked: Custom ‘Phoenix’ cores, TSMC 3nm process
- Snapdragon 8 Gen 4 to be made by TSMC, for Galaxy by Samsung
- TSMC to produce 3nm Snapdragon 8 Gen 4: No talks w/ Samsung
// Via
Samsung is expected to hold the next Unpacked event in January next year. After leaked hands-on, new live images of the Galaxy S24 Ultra have surfaced, showing off design changes over its predecessor.
In the Galaxy S24 Ultra, Samsung is not heavily tweaking the overall look and design. While the display is ditching curved edges, the rear design looks a lot identical to the S23 Ultra, which is hard to compare.
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As you can see in the image showing the phone’s bottom, the speaker grille has ditched the holes in favor of a single linear cutout. The company has also flattened out the bottom of the S Pen.
Notably, the Galaxy S24 Ultra makes use of a titanium frame instead of aluminum, while other models follow the older frame strategy.
