Technology
Meet Samsung’s new ‘Slim Hinge’ that used in Galaxy Z Flip 4 and Fold 4 [Video]
Samsung launched the Galaxy Z Fold 4 and Galaxy Z Flip 4 with a new and updated “Slim Hinge” that makes everyday experiences epic. While the Galaxy Z Flip 4 offers a compact form factor with a stylish design, the Fold 4 works just like a PC in hand, thanks to its bigger foldable screen.
Durability is the biggest concern on these kinds of smartphones, while, Samsung managed to make the Galaxy Z Fold 4 and Galaxy Z Flip 4 even more durable by using the new and updated “Slim Hinge.” Let’s have a look at how the new hinge is different and works inside your foldable.
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Samsung’s new “Slim Hinge”
Samsung disclosed that it had seen the possibility of slimming down the Galaxy Z Flip 4’s design by using the new Slim Hinge to make it even more compact. Moreover, the new hinge technology allowed the manufacturer to modify the dimensions on Z Fold 4.
Thanks to the new Slim Hinge, the Galaxy Z Fold 4 now has a slightly wider and slightly shorter Cover Screen. It enables a more comfortable experience while typing on the go and doing other tasks on the Cover Screen, without unfolding the device frequently.
These small internal structural and elemental changes are just incremental but play a key role in enhancing user experiences. Samsung’s new redesigned hinge technology comes with benefits to both manufacturing and longevity in addition to making the user experience comfortable.
The last generation of Hinge design made foldable phones possible, and regular improvements and significant updates are ensuring the future of the new form factor of smartphones. With the upcoming foldables, the Korean tech giant will surely introduce an even better hinge with more durability.
Qualcomm may stick with TSMC for the 3nm Snapdragon 8 Gen 4 processor’s production next year. Earlier, the company was rumored to shift to a multi-foundry strategy, but it won’t happen next year. Samsung also has some 3nm clients, but no flagship product has been ordered.
According to China Times, Qualcomm and MediaTek plan to use the second-gen TSMC 3nm process to fabricate Snapdragon 8 Gen 4 and Dimensity 9400. The new N3E tech offers performance and efficiency improvements over the N3B, which is used in Apple’s A17 Pro.
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Reports suggest that the Taiwanese chip manufacturer is producing 60,000 to 70,000 wafers per month using its 3nm process. This number is expected to rise to 100,000 wafers by the end of next year. As of now, 5% of its revenue comes from its 3nm process, which will rise to 10% next year.
South Korea-based AI fabless startup, Rebellions, is gearing up for mass production of data center-specific artificial intelligence (AI) chips using Samsung Foundry’s EUV (extreme ultraviolet ) process at the 5nm level.
BusinessKorea reports that Rebellions completed a mass production contract last week with SEMIFIVE for the Samsung 5-nm AI semiconductor ATOM, with mass production set to commence early next year.
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ATOM
ATOM is known for its industry-leading graphics processing unit (GPU) performance and up to 3.4 times greater energy efficiency compared to equivalent neural network processors (NPU).
Particularly notable is ATOM’s performance in the Global Benchmark, where it outperformed competitors like Nvidia and Qualcomm by 1.4 to 3 times, sparking significant interest.
Earlier this year, Rebellions produced prototypes of ATOM through Samsung Foundry’s “Multi-Project Wafer Service,” which prints various types of semiconductors on a single wafer.
Rebel
Rebellions is also strengthening its collaboration with Samsung, co-developing the next-gen semiconductor Rebel, specialized for Large Language Models (LLM), which is being developed using Samsung Foundry’s 4-nm process.
Announced earlier this month, MediaTek’s Dimensity 9300 is giving tough competition to Qualcomm’s new Snapdragon 8 Gen 3 flagship processor. Vivo recently launched X100 boasting Dimensity 9300, while most of the upcoming Android flagships use Snapdragon 8 Gen 3.
It’s worth mentioning that the running score of Dimensity 9300 is slightly better than Qualcomm’s 8 Gen 3 SoC. The new MediaTek chipset is rivaling well against Qualcomm’s matured Snapdragon chipset portfolio due to its full-core CPU.
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Tipster DCS notes that the Dimensity 9300 performs well in medium and high-load energy consumption. At the same time, it’s slightly better than Snapdragon 8 Gen 3 in high-load mobile games in the same scenario.
Genshin Impact 720p full high image quality is 59.6fps, consuming 4.7W. On the other side, the 8 Gen 3 does better in low-load games, while Dimensity 9300 isn’t far behind.
Dimensity 9300
Fabricated on TSMC’s 3rd-gen 4nm+ process, the all-big core CPU design is the highlighting feature of the Dimensity 9300 processor. It features a prime Cotex-X4 core clocked at 3.25GHz alongside 3x Cortex-X4 cores @ 2.85GHz and 4x Cortex-A720 cores @ 2.0GHz.
// DCS / Weibo