Samsung may soon introduce its next smart tracker, the Galaxy SmartTag 3. New leaked images have revealed what the device could look like.

According to the images shared by WinFuture, the biggest change is the design. Unlike the Galaxy SmartTag 2, which has a pill-like shape, the new model appears to have a small square shape with rounded corners. The leaked images also show two color choices, with a large Samsung logo visible on the front.

However, Samsung seems to have made one major change that some users may not like. The new SmartTag 3 does not appear to have a built-in hole for attaching it directly to a keyring, strap, or carabiner. Instead, users may have to use a separate case or accessory.

Image via WinFuture

Samsung is reportedly preparing several cases, including silicone, leather, and bumper options. There could also be an accessory designed to attach the tracker to a pet’s collar. Companies such as Spigen may offer some of these accessories. The tracker is reportedly around 30 x 30mm in size and less than 10mm thick. It will also use a replaceable coin-cell battery.

For connectivity, the SmartTag 3 is expected to support Bluetooth Low Energy and Ultra-Wideband. These features should help users locate their lost belongings more easily.

Samsung could launch the Galaxy SmartTag 3 soon. The expected price is around $30 in the US and €28 in Europe. A four-pack may cost about $100 in the US and €93 in Europe. The SmartTag 3 could be a useful option for tracking keys, bags, pets, and other valuables.

Samsung is reportedly developing its first humanoid robot and may show its prototype at CES 2027 in Las Vegas next January. CES is one of the world’s biggest technology events, where companies display new products and technologies.

The company is preparing the robot through its Robotics (RX) Business Promotion Office. The company is working on both the robot’s body and its AI software. The hardware includes parts such as the joints, hands, and other moving parts. The AI software will help the robot understand things, make decisions and perform tasks.

Jang-Hyun Yoon, Samsung’s Chief Technology Officer and President of the DX Division, is leading both the hardware and AI software teams. This means Samsung can develop the robot’s body and “brain” together, which could help speed up development.

Samsung has also been working on new robot technologies. It has patents related to hip joints, advanced robotic hands and AI systems that control robot movements.

The company is also working with its subsidiary, Rainbow Robotics. Rainbow Robotics is focusing mainly on industrial robots for factories and workplaces. Its RB-Y2 is a two-arm robot designed to carry heavy loads and work over a large area. An improved version may be shown at RoboWorld 2026.

Samsung and Rainbow Robotics are following different paths. Samsung is expected to focus on general-purpose humanoid robots, while Rainbow Robotics will focus on industrial robots. Samsung has not officially confirmed its CES 2027 plans, saying it “cannot confirm” the report.

Hey everyone, if you have been following the crazy growth in AI, you know memory isn’t just about speed anymore, it’s about keeping things from melting under insane workloads.

Samsung just dropped something pretty cool (well, it needs to be cool) at Computex 2026: the first physical mockup of its next-gen HBM5 memory, integrated with a new trick called the Heat Path Block, or HPB. I dug into the details from reliable reports, and it’s a smart move in the ongoing battle for AI dominance.

Why Heat is the New Bottleneck in AI Memory

High Bandwidth Memory (HBM) is the super-fast RAM that powers today’s AI GPUs and accelerators. It is like a skyscraper: multiple DRAM dies stacked vertically on top of a logic “base die” that talks directly to the processor. This setup gives massive bandwidth (terabytes per second), but it also generates a ton of heat, especially where the high-speed connections (called Die-to-Die or D2D interfaces) sit.

As stacks get taller and speeds climb (we are talking 14-16 Gbps now, with even more coming), that heat concentrates in the PHY area (the PHY area is basically the ‘communication zone’ on the base die where the super-fast data connections between the HBM memory and the GPU happen, and it’s also one of the hottest spots in the whole package).

Traditional cooling through the top of the stack or sides just isn’t cutting it anymore. Without better thermal management, performance throttles, systems become unstable, or you waste power on cooling.

Samsung’s rival SK hynix recently showed its iHBM (I will provide detailed information about iHBM very soon and link here) with built-in cooling elements. Samsung has an answer? HPB. It’s not copying, it’s a different but equally clever approach to the same problem.

What Exactly is Heat Path Block (HPB)?

If I want to explain “What is HPB?” easily, I will tell you to add a dedicated “chimney” right next to the memory stack. That’s basically HPB.

Instead of forcing all the heat to go through the DRAM dies (which aren’t great at conducting heat away quickly), HPB creates an independent thermal pathway. This structure (think thermal pillars or a block) sits on the same base die, pulls heat directly from the hot PHY region, and sends it to a heat spreader on top or the side of the package.

Samsung has already tested and verified this on its HBM4E samples (the 12-high stacks shipping now). It lowers thermal resistance, keeps temperatures more stable, and lets the memory run harder for longer without issues. Samsung first used a version of HPB in Exynos 2600 mobile processors, where it improved thermal performance noticeably, up to around 16% better resistance in some tests by optimizing the package layout.

In the Computex HBM5 mockup, you can see the HPB structure alongside the core die stack. It’s a physical demonstration that this isn’t just a paper promise, it’s real hardware.

Via – @SemiconductorX/X

The 2nm Process Tech

The HPB isn’t the only upgrade. Samsung is going aggressive on manufacturing too. The Base Die for HBM5 will be built on Samsung’s own 2nm process node (using Gate-All-Around transistors). That’s a big jump from the 4nm used in HBM4 and HBM4E.

Why does this matter? A more advanced process means better power efficiency and higher performance in the logic part that handles all that high-speed data traffic. The core DRAM layers will use advanced 1c (6th-gen 10nm-class) technology, with potential for even denser stacks.

This is where Samsung’s unique position works. As an IDM (Integrated Device Manufacturer), the company designs both the memory and the foundry processes. Samsung’s CTO, Song Jae-hyuk, highlighted how this lets them optimize die placement and heat paths faster than competitors who might rely more on external partners. I am personally excited about this 2nm development. Good work, Sammy.

Samsung’s AI Memory Push

This HBM5 news is part of Samsung’s bigger push in AI. The company is speeding up its factory investments; for example, Samsung moved the groundbreaking for its new P5 Fab 2 in Pyeongtaek forward by 6 months to July 2026. The goal is clear: produce a lot more memory to meet the exploding demand for AI chips.

HBM5 is expected to target mass production around 2028, following samples and validation. For context, HBM4E already delivers impressive specs: up to 3.6 TB/s bandwidth per stack, 48GB capacity in higher configs, and it’s over 20% faster than previous generations in some cases. You will see HBM5 pushing those numbers further while staying cooler.

Better thermal performance lets AI systems run at full speed for longer without slowing down or using too much extra power. That’s a big deal for data centers handling huge AI training or inference jobs.

Competition and the Industry Benefits

The HBM race is really heating up. SK Hynix has been leading the market share (57-62%) for high-end HBM, but Samsung (17-22%) is fighting back strongly with new innovations. Samsung’s HPB uses a dedicated external heat path, while SK hynix’s iHBM puts cooling elements inside the package. Both solutions target the same hot spot, showing that good thermal management is now just as important as raw speed or stacking more layers.

For big customers like NVIDIA, who still rely heavily on SK hynix today but are starting to diversify. These improvements mean more reliable and power-efficient memory. Samsung is also preparing its full AI memory lineup for upcoming platforms like NVIDIA’s Vera Rubin.

Meanwhile, Micron is also competing strongly by ramping up its HBM4 with excellent power efficiency and is already sold out for 2026, while preparing its own solutions for the upcoming HBM5 generation to challenge Samsung and SK Hynix.

From a business side, stronger HBM products could help Samsung win back ground in this high-profit AI memory market. Memory prices go up and down, but the strong demand from AI continues to be a big advantage.

Challenges and Opportunities

Of course, nothing is guaranteed. Samsung still has to successfully scale up its 2nm production, maintain good yields on these complex stacked packages, and keep costs under control. But its vertical integration, controlling both memory and chip manufacturing, gives it some unique advantages that others don’t have (you are winning here, Sammy).

For chip enthusiasts and semiconductor professionals, this is really exciting. It shows how innovation in packaging and thermal management is keeping up with smaller chip processes. As AI models keep getting bigger, the hardware underneath needs to evolve too, not just faster, but also smarter about power and heat.

If you are into chips, keep watching HBM developments closely. What started as a special memory for graphics cards has now become a key part of the AI revolution.

Samsung’s HBM5 with HPB feels like a strong step toward making those giant GPU clusters more efficient and reliable.

Samsung’s new Exynos 2600 processor is gaining attention because of its advanced cooling system, Heat Pass Block (HPB). This new technology helps the chip stay cooler and work faster for a longer time, mainly during gaming and heavy tasks.

Today’s smartphones become hot quickly because powerful processors create a lot of heat. Most premium phones use vapor chambers to control temperature, but Samsung has added something extra. The company placed a copper cooling layer directly on top of the processor to move heat away more efficiently.

Most smartphone companies, including Apple, use a design where memory is placed on top of the processor to save space inside the phone. While this makes phones thinner, it also traps heat. As a result, processors slow down after some time to avoid overheating. This problem is thermal throttling.

According to tests by YouTuber Geekerwan, the Exynos 2600 performed better than Qualcomm’s Snapdragon 8 Elite Gen 5, even when the Snapdragon chip was cooled using liquid nitrogen. Surprisingly, the Snapdragon processor still could not maintain stable performance for long periods.

The Exynos 2600 is not completely free from heating issues. The Galaxy S26+ still showed some throttling during long gaming sessions because its cooling system is smaller than that of the Galaxy S26 Ultra. However, adding a small clip-on fan to the back of the phone helped improve cooling and performance.

Samsung’s new HPB cooling system could become very important for future smartphones. Other companies like Qualcomm, Apple, and MediaTek may also adopt similar cooling methods in upcoming processors.

Qualcomm has introduced a new chip, the Snapdragon C Platform. This chip is made for low-cost laptops. It is expected to be used in laptops made by companies like Samsung, Acer, HP, and Lenovo.

The main aim of Qualcomm’s Snapdragon C is to make cheap laptops faster, more efficient, and longer-lasting. These laptops are expected to start at around $300, which makes them more affordable for many people.

Snapdragon C chip is designed for daily use, like browsing the internet, watching videos, attending online classes, and doing office work. It also includes a special AI part, an NPU. This helps laptops do smart tasks faster, like improving video calls or helping apps run better.

The biggest benefit of Snapdragon C is better battery life. Laptops using this chip are expected to last all day on a single charge. They also run cooler and quieter, so fans will not make much noise.

Due to these improvements, the Snapdragon C chip could make laptops like the Samsung Galaxy Book series more powerful in the budget category. It may also help them compete better with Apple’s MacBook line, including models like the MacBook Neo.

However, the real performance will depend on how laptop companies use the chip and how well the software works with it. This chip could change the entry-level laptop market. The first Snapdragon C laptops are expected to come out later this year.