Samsung explores 3D Chiplet tech to enhance Exynos chips

Samsung is reportedly discussing ways to use 3D Chiplet tech to improve Exynos chipset’s productivity. It has been disclosed that the company is actively considering the application of this next-generation packaging technology in Exynos mobile chips.

There will be many challenges in commercialization, however, the application is the way to go as front-end process tech is reaching its physical limits. 3D packaging technology makes it easy to reduce the overall package size alongside improving bandwidth and power efficiency.

Follow our socials → Google News | Telegram | X/Twitter | Facebook | WhatsApp

3D Chiplet

3D Chiplet technology attracting attention mainly in advanced semiconductor fields such as HPC (High Performance Computing) and AI (Artificial Intelligence). It is estimated that it can bring various advantages to mobile chipsets, such as miniaturization and improved performance.

An official familiar with the matter said, “Samsung Electronics is internally considering applying 3D chiplets to Exynos,” adding, “The judgment was that there were significant benefits that could be gained through this.”

//ZDNet