Samsung is reportedly working to develop a new automotive chip packaging technology with its key partners. The company is developing an aluminum oxide (Al2O3) coating bonding...
Samsung, Intel, and TSMC are working together to establish advanced chip-packaging and stacking technology. This advanced tech will be used to develop the next generation and...
On May 06, 2021, Samsung announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4) to lead the evolution of chip packaging technology once...