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Ex-TSMC expert leaves Samsung amid Foundry troubles
Former TSMC expert, Lin Juncheng resigned from Samsung Electronics. The company hired Lin to lead its semiconductor packaging capabilities. It comes amid the Foundry business is having significant troubles.
FNNews reports that Lin, who was part of the Semiconductor Research Institute’s System Package Lab, officially resigned after his contract ended. In a statement on his social media, Lin expressed pride in his contributions, saying:
“I am happy to have contributed to both the company’s and my personal career development by applying Samsung’s advanced packaging technologies, such as 3D integrated circuits (3DIC), hybrid copper bonding for HBM 16-layer, I-CubeE, I-CubeR, and chip-on-package optical (CPO).”
Rumors in the chip industry circulated late last year regarding Lin’s potential move to a Chinese or Taiwanese company. These speculations grew as his contract with Samsung’s Semiconductor (DS) Division expired on December 31.
A packaging expert with extensive experience at TSMC (from 1999 to 2017), Lin later worked at Micron and Skytech before joining Samsung. At Samsung, he played a pivotal role in developing next-gen HBM packaging tech, including the HBM4.
With Moore’s Law nearing its limits, the importance of packaging capabilities has grown significantly. In 2022, Samsung established the Advanced Packaging (AVP) business team, highlighting its strategic focus on this area.
Lin’s recruitment was seen as a key move to expand Samsung’s AVP business. However, after VC Jeon Young-hyun assumed leadership of the DS Division, the AVP business team was reorganized into the AVP Development Team.
