Samsung, TSMC on different path to innovate FOPLP process

Samsung and TSMC have embarked on a notable path of divergence when it comes to the materials used in their next-generation fan-out panel-level packaging (FOPLP) solutions.

Digitimes reports that Samsung sticking with plastic, while TSMC is exploring glass panels for FOPLP. This difference could have significant implications for the future of chip packaging tech.

Samsung has chosen to continue with plastic as its panel material for FOPLP.

• Plastic (organic substrates) have long been a staple due to their flexibility, cost-effectiveness, and established manufacturing processes.

TSMC is exploring the use of glass panels for its FOPLP endeavors.

• Glass has several advantages over plastic, including superior thermal stability, flatness, and the potential for even tighter interconnect pitches.

The next-gen fan-out panel-level packaging allows for the production of chips in larger, rectangular panels rather than the traditional round wafers.

This way, chip producers can increase the number of chips produced per panel and reduce waste. Well, innovation doesn’t stop here; Samsung and TSMC exploring rooms for improvements.

FOPLP is particularly advantageous for the packaging of advanced chips used in artificial intelligence (AI) applications, where size, performance, and cost are critical.

Samsung’s memory business is booming but the Mobile AP division is sluggish. TSMC is leading the market with more than half share thanks to its stable foundry process with higher yields.