Samsung to reshape semiconductor packaging for AI era

Samsung could restructure its semiconductor packaging for the AI era. The company will likely overhaul its advanced semiconductor packaging supply chain on a large scale.

According to ETNews, Samsung has started to reconfigure its advanced semiconductor packaging supply chain for AI era. The firm is reviewing its current supply chain and working to form a fresh supply chain as part of enhancing packaging competitiveness.

HBM is a crucial component for AI data centers and advanced servers. Korea-based Samsung and SK Hynix are currently the largest HMB memory chip suppliers in the world.

The Korean tech giant is expected to conduct a “fundamental review” of materials, parts, and equipment. The move is solely aimed at strengthening its technological competitiveness.

Changes are expected from the development stage to purchasing, and this is likely to have significant implications for both domestic [Korean] and international semiconductor industries.

Notably, the company is first focusing on equipment, planning to prioritize “performance” from the start, regardless of existing relationships or cooperation.

Samsung has reportedly considered returning purchased equipment. While equipment was bought to build a packaging line, the company is reassessing these purchases in line with its review policy.

Industry sources familiar with the matter have said, “Some equipment is under consideration for return,” and “A fundamental review is underway, with the ultimate goal being to diversify and replace the existing supply chain.”

Given the supply chain restructure, Samsung may also reshuffle the cooperation landscape. If equipment suppliers diversify, changes in the related materials supply chain will also be inevitable.