Lin Jun-cheng, who previously worked at Taiwan-based TSMC has joined Samsung Electronics, reports say. The company appointed Lin as Senior Vice President of the advanced packaging team under Samsung’s chip business division, Device Solutions.
In addition, the KoreaHerald report believes that Lin Jun-cheng’s key responsibility is likely to be overseeing the development of cutting-edge packaging technology, which plays a key role in enhancing advanced higher-performance chipsets.
From 1999 to 2017, Lin worked at TSMC and then served as CEO of Taiwanese semiconductor equipment maker Skytech. It shows how Samsung beefs up efforts to strengthen its prowess in chip packaging under the leadership of Samsung’s co-CEO Kyung Kye-hyun.
In the recent past, the South Korean tech giant established a dedicated team as part of research and development on its dream chipset. To speed up the development and accuracy of the project, the company is continuously putting in efforts and hiring expertise from various tech titans.
A task force is also said to have been launched last year to speed up the commercialization of advanced packaging technology. Last year, Samsung also hired Kim Woo-pyeong, a former engineer at Apple – another archrival – as head of the company’s packaging solution center in the US.
TSMC to produce 3nm Snapdragon 8 Gen 4: No talks w/ Samsung
Qualcomm may stick with TSMC for the 3nm Snapdragon 8 Gen 4 processor’s production next year. Earlier, the company was rumored to shift to a multi-foundry strategy, but it won’t happen next year. Samsung also has some 3nm clients, but no flagship product has been ordered.
According to China Times, Qualcomm and MediaTek plan to use the second-gen TSMC 3nm process to fabricate Snapdragon 8 Gen 4 and Dimensity 9400. The new N3E tech offers performance and efficiency improvements over the N3B, which is used in Apple’s A17 Pro.
Reports suggest that the Taiwanese chip manufacturer is producing 60,000 to 70,000 wafers per month using its 3nm process. This number is expected to rise to 100,000 wafers by the end of next year. As of now, 5% of its revenue comes from its 3nm process, which will rise to 10% next year.
Samsung to produce 5nm AI chips for Rebellions
South Korea-based AI fabless startup, Rebellions, is gearing up for mass production of data center-specific artificial intelligence (AI) chips using Samsung Foundry’s EUV (extreme ultraviolet ) process at the 5nm level.
BusinessKorea reports that Rebellions completed a mass production contract last week with SEMIFIVE for the Samsung 5-nm AI semiconductor ATOM, with mass production set to commence early next year.
ATOM is known for its industry-leading graphics processing unit (GPU) performance and up to 3.4 times greater energy efficiency compared to equivalent neural network processors (NPU).
Particularly notable is ATOM’s performance in the Global Benchmark, where it outperformed competitors like Nvidia and Qualcomm by 1.4 to 3 times, sparking significant interest.
Earlier this year, Rebellions produced prototypes of ATOM through Samsung Foundry’s “Multi-Project Wafer Service,” which prints various types of semiconductors on a single wafer.
Rebellions is also strengthening its collaboration with Samsung, co-developing the next-gen semiconductor Rebel, specialized for Large Language Models (LLM), which is being developed using Samsung Foundry’s 4-nm process.
MediaTek Vs Qualcomm: Dimensity 9300 giving tough competition to Snapdragon 8 Gen 3
Announced earlier this month, MediaTek’s Dimensity 9300 is giving tough competition to Qualcomm’s new Snapdragon 8 Gen 3 flagship processor. Vivo recently launched X100 boasting Dimensity 9300, while most of the upcoming Android flagships use Snapdragon 8 Gen 3.
It’s worth mentioning that the running score of Dimensity 9300 is slightly better than Qualcomm’s 8 Gen 3 SoC. The new MediaTek chipset is rivaling well against Qualcomm’s matured Snapdragon chipset portfolio due to its full-core CPU.
Tipster DCS notes that the Dimensity 9300 performs well in medium and high-load energy consumption. At the same time, it’s slightly better than Snapdragon 8 Gen 3 in high-load mobile games in the same scenario.
Genshin Impact 720p full high image quality is 59.6fps, consuming 4.7W. On the other side, the 8 Gen 3 does better in low-load games, while Dimensity 9300 isn’t far behind.
Fabricated on TSMC’s 3rd-gen 4nm+ process, the all-big core CPU design is the highlighting feature of the Dimensity 9300 processor. It features a prime Cotex-X4 core clocked at 3.25GHz alongside 3x Cortex-X4 cores @ 2.85GHz and 4x Cortex-A720 cores @ 2.0GHz.
// DCS / Weibo