Technology
Phone will become laptop, Samsung invents foldable + slidable display
Samsung Display has successfully developed an innovative kind of display that combines foldable and slideable OLED. According to Korean media, the company will introduce the foldable + slidable display product at CES 2023, which begins on the 5th.
The South Korean tech giant is going to be the first vendor by showcasing such kind of innovative display that unites both foldable and slidable form factors. Foldable smartphones are already available in the market, while the slidable display has not yet been commercialized.
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The company has reportedly planned to unpack a new product that combines foldable and slidable to some invitees at a CES closed (private) booth. As reported, Samsung Display calls it a ‘hybrid’ panel as it combines two functions into one.
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ETNews reports, after unfolding the folded screen, the design is in the form of an additional screen that comes out when one end is pulled. In folded condition, the screen expands to 8 inches, and it further extends to 10 inches when unfolded, which can be expanded up to 12.4 inches with slidable method.
The Galaxy S22 Ultra comes with a huge 6.8-inch display, while the display that Samsung invented expands to 8 inches in normal state. It can be maximized to 12.4 inches, which is the size of a tablet or a laptop’s screen. We can assume, this hybrid panel may bring phone, tablet and laptop together in one package.
Apple’s iPhone 15 Pro and iPhone 15 Pro Max are equipped with an A17 Pro chipset, manufactured on TSMC’s 3nm process tech. It became the most powerful smartphone chip on Geekbench, following its debut. Notably, Apple’s A17 Pro used in the iPhone 15 Pro is one of the fastest phones on AnTuTu.
According to the info, the A17 Pro inside the iPhone 15 Pro and 15 Pro Max is one of the fastest phones on AnTuTu with a combined score of 1,641,883 points. This score surpasses the Android-leading nubia Red Magic 8 Pro+ which scores 1,632,859 points.
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It’s worth mentioning that the A17 Pro brings a 392,643-point CPU score and a 597,734-point outing for the GPU department. For reference, last year’s A16 Bionic chip managed a 1,474,011 score while the Apple M1 chip found on Apple laptops and iPads is just a hair away at 1,754,456 points.
Earlier, Samsung released The Freestyle 2nd Gen which makes imagination a reality. Recently, Samsung interviewed key players of The Freestyle 2nd Gen development, including Wonki Kim from the Lifestyle Team, Seongwon Seo from the Picture Quality Solution Lab, and TJ Kim from the Future Planning Group.
Smart Edge Blending is one of the biggest upgrades in The Freestyle 2nd Gen.
Smart Edge Blending seamlessly merges projections from two The Freestyle devices to create a large screen for pictures and videos. By connecting the two devices to the SmartThings app and synchronizing the video output with a photo of the projected screens, users can enjoy a full-screen experience from anywhere.
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Gaming through Samsung Gaming Hub
Through Samsung Gaming Hub, The Freestyle 2nd Gen supports gaming — a content form that was once unimaginable to enjoy on a portable projector. The addition of Samsung’s cloud gaming platform frees users from the limitations of consoles, wires and fixed screens such as smart TVs and monitors.
Screens Everywhere as a strategy
With the vision of “Screens Everywhere, Screens for All, The Freestyle 2nd Gen prioritizes portability and mobility to enable users to experience the benefits of a movable screen. Samsung’s goal is to move beyond simply targeting the existing market and present a new screen experience for everyone.
Recent developments suggest that Samsung is all set to ship the Galaxy S24 series with Exynos chip in select regions. However, the latest information talks about Galaxy S24’s Exynos chip’s mass production timing and packaging technology.
According to tipster Revegnus, Samsung is planning to produce an Exynos 2400 processor on FO-WLP packaging technology. It will be the first time the company will use this process for the production of Exynos smartphone chipsets.
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The source also revealed that the Galaxy S24 series is scheduled for early 2024 release. Meanwhile, the mass production of its Exynos 2400 chipset could start in the fourth quarter of this year, utilizing the Fan-out wafer-level packaging technology.
FO-WLP
Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions. [Source]