News
Samsung is looking to develop 1.4nm semiconductor chips by 2027
Today, at the annual Samsung Foundry Forum event, the company has officially unveiled its plans for Foundry Business with the introduction of cutting-edge technologies. Samsung is planning to manufacture 2nm process technology by 2025 and 1.4nm semiconductor chips by 2027.
Samsung is the world’s second-biggest semiconductor chip manufacturing firm. The company reveals that the demand for advanced semiconductors has increased dramatically and that’s because of the significant market growth in high-performance computing (HPC), artificial intelligence (AI), 5G/6G connectivity, and automotive applications.
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Therefore, Samsung emphasized its promise to bring its most advanced process technology, 1.4nm semiconductor chips for mass production in 2027.
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In addition to this, the Korean company has also highlighted the steps its Foundry Business is taking in order to meet customers’ needs. These include:
- Foundry process technology innovation
- Process technology optimization for each specific applications
- Stable production capabilities
- Customized services for customers
President and head of Samsung Foundry Business said that technology development targets of up to 1.4nm and specialized foundry platforms for each application, along with stable supply through continued investments, are part of Samsung’s strategies to secure customer trust and support their success.
Samsung 1.4nm Advanced Node Roadmap:
Samsung gains huge success with the latest 3nm process technology. With this, the company plans to further enhance the Get-All-Around (GAA) based technology and schedules to launch a 2nm process in 2025 and a 1.4nm process in 2027.
In the meantime, the company is also gearing up the development of 2.5D/3D heterogeneous integration packaging technology to provide a total system solution in foundry services.
According to the information, Samsung’s 3D packaging X-Cube with micro-bump interconnection will be ready for mass production in 2024, and bump-less X-Cube will be available in 2026.
Furthermore, the company has also unveiled that it is planning to expand its production capacity for the advanced nodes by more than three times by 2027 compared to this year. At the event, it detailed the “Shell-First” strategy for capacity investment to better respond to customers’ demands.
Lastly, Samsung said that it will hold the ‘SAFE Forum’ (Samsung Advanced Foundry Ecosystem) on October 4th. At that event, it will introduce foundry technologies and strategies with ecosystem partners such as Electronic Design Automation (EDA), IP, Outsourced Semiconductor Assembly and Test (OSAT), Design Solution Partner (DSP), and the Cloud.
For more information, visit Samsung Newsroom.
News
Apple prioritizes uniqueness before rivaling Samsung foldables
Apple doesn’t want to enter the Samsung-led foldables market without technological uniqueness. The company has been absent from the rapidly growing foldable segment, which recently welcomed a triple foldable handset from Huawei.
According to Kipost, Apple is seeking its own supply chain of ultra-thin glass technology. The company desires to have its own control over some particular aspects. The move is to differentiate technological innovation from Samsung.
Samsung is expected to supply OLED panels for foldable Apple products. Ultra-thin glass, which is a crucial component in foldable screens, is largely controlled by Samsung D. The reason is the company’s saturation in the international market.
Apple doesn’t reportedly want everything to be done by display manufacturers. If it happens, the company won’t have anything to differentiate its product from rivals. The desire is necessary as Apple is already too late in the market.
Apart from ultra-thin glass, the US tech giant is looking to attain control over supply chain management too. The company is also exploring backplate technology, to ensure critical areas of demonization without any hurry.
UTG is a key material used in foldable displays, which is responsible for flexibility and durability. Backplate in foldable devices often refers to the component that supports the display, which should be durable for long-lasting products.
The report suggests Apple wants uniqueness in two crucial materials—UTG and backplates. This means Samsung Display won’t be able to breathe freely even after being the main foldable panel supplier for Apple’s future foldable devices.
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Samsung bolsters role in Japan’s 5G expansion with KDDI
Japan’s KDDI selected Samsung as the main vendor for 5G expansion. Samsung’s vRAN will be deployed by KDDI starting next year for 5G expansion. The company will provide 4G and 5G O-RAN-compliant vRAN solutions in Japan.
Samsung today confirmed selection by KDDI as a key 4G and 5G O-RAN compliant vRAN provider for their Open RAN deployment in Japan. The partnership with KDDI will help Samsung strengthen its role in Japan’s 5G expansion.
“Together with KDDI, we are thrilled to take this significant step and strengthen our presence in Japan,” said Junehee Lee, Executive Vice President, Head of Global Sales & Marketing, Networks Business at Samsung Electronics.
The South Korean tech giant noted that it’s bringing vRAN 3.0 solution, a full suite of O-RAN compliant radios supporting low- and mid-bands including advanced Massive MIMO radios and third-party radio integration support.
Kazuyuki Yoshimura, Chief Technology Officer of KDDI: “Today’s announcement represents KDDI’s dedication to bringing innovative technologies to Japan. We are proud to deliver a cutting-edge and reliable radio access network.”
Key features of Samsung CognitiV Networks Operations Suite (NOS) will also be offered. The features streamline the onboarding, deployment, and operation processes, enabling KDDI to transform its widespread network efficiently.
Beyond that Samsung and KDDI will expand the reach of Open RAN in the coming years. For now, KDDI’s Open RAN network will feature enhanced capabilities for improved energy efficiency, optimized performance, and intelligent automation.
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Samsung Wallet ‘Tap to Transfer’ takes lead over iOS 18’s Tap to Cash
Samsung Wallet getting an instant Tap to Transfer feature for Galaxy users. The latest addition unlocks instant and seamless money transfer. This move reiterates Samsung’s commitment to upscaling the Galaxy ecosystem.
The Tap to Transfer feature allows users of Samsung Wallet on Galaxy phones to instantly transfer money by tapping the backs of their devices together. The transfer process is powered by NFC technology embedded in Galaxy phones.
Samsung confirmed that the feature will be gradually supported through app updates in Samsung Wallet. The Tap to Transfer feature eliminates the need to ask for or input the recipient’s account number during transfers.
This seamless process will help Galaxy users save time and effort as well as reduce the risk of sending money to the wrong account. It’s an answer to Apple iOS 18’s Tap to Cash feature, which allows users to transfer funds with nearby ecosystem devices.
Samsung Wallet allows the recipient to set a representative account for receiving funds and can receive ‘Tap to Transfer’ payments even when their Galaxy’s screen is off – even without opening the Samsung Wallet app.
Here’s how it works:
The user who wants to send money enters the password for their registered account in Samsung Wallet, inputs the transfer amount, then taps their phone against the recipient’s phone and completes the transfer through the default unlock method.
The recipient’s account number transmitted during the ‘Tap to Transfer’ process is encrypted and sent to the sender. Instead of displaying the full account number, only the last four digits of the recipient’s mobile phone number are shown.
The feature is currently available in South Korea and supported by Woori Bank.