Technology
India will become the world’s 2nd biggest semiconductor customer by 2026, Counterpoint predicts
Recently, Counterpoints and IESA (Indian Electronic and Semiconductor Association) together prepared the ‘2019-2026 India Semiconductor Market Report’. As per the report, India will become the second largest semiconductor customer by 2026.
Download Sammy Fans App
The report mentioned that the cumulative revenue of India’s semiconductor components market to climb to $300 billion in 2021-2026. In the year 2021, India’s end equipment market stood at $119 billion in terms of revenue and it is expected to grow at a CAGR of 19% from 2021 to 2026.
Join SammyFans on Telegram
Currently, the IT and industrial sectors contribute about 80% of India’s semiconductor revenue. ‘Make in India’ and production-related incentive schemes will facilitate local sourcing of semi-components in the coming years. Further policy reforms and building a semiconductor ecosystem will reduce dependence on semiconductors
Follow Sammy Fans on Google News
In terms of size and growing demand for semiconductor components across multiple industries and applications, India is going to become the world’s second-largest market.
This demand is driven by the rapid pace of digital transformation of consumers, businesses, and the public sector in the country, from enhanced connectivity to cloud content consumption through the adoption of new technologies. These include smartphones, PCs, wearables, cloud data centers, Industry 4.0 applications, IoT, smart mobility, and advanced telecom and utility infrastructure.
According to IESA CEO and President Krishna Moorthy:
‘Before the end of this decade, there will be nothing that will not be touched by electronics and the ubiquitous ‘chip’. Be it fighting carbon emissions, renewable energy, food safety, or healthcare, the semiconductor chip will be all-pervasive. Imagine this – all children all over India get educated in virtual classrooms by the country’s best teachers. The chip makes it possible. Again, imagine everyone in the country gets quality healthcare and diagnostics done remotely. Medicines are delivered by drones at your doorstep, even in the farthest villages of India. The chip will make it possible, and we will see this in front of our eyes very soon. Let us make India the semiconductor nation.’
As per Research Director at Counterpoint Research Tarun Pathak:
The mobile and wearables sector was the biggest contributor to India’s semiconductor industry in 2021. Mobile devices have become a primary tool for internet connectivity given that broadband and laptop/PC penetration remains low. In the last five years, the ‘consumer digital transformation’ has accelerated with the availability of cheap mobile internet, and mobile devices have connected a big part of the Indian population. Also, the gradual shift from feature phones to smartphones has been generating increased proportions of advanced logic processors, memory, integrated controllers, sensors and other components. This will continue to drive the value of the semiconductor content in smartphones, which is still an under-penetrated segment in India, aided by the rise of wearables such as smartwatch and TWS.”
Apple’s iPhone 15 Pro and iPhone 15 Pro Max are equipped with an A17 Pro chipset, manufactured on TSMC’s 3nm process tech. It became the most powerful smartphone chip on Geekbench, following its debut. Notably, Apple’s A17 Pro used in the iPhone 15 Pro is one of the fastest phones on AnTuTu.
According to the info, the A17 Pro inside the iPhone 15 Pro and 15 Pro Max is one of the fastest phones on AnTuTu with a combined score of 1,641,883 points. This score surpasses the Android-leading nubia Red Magic 8 Pro+ which scores 1,632,859 points.
Follow our socials → Google News, Telegram, X (formerly Twitter), Facebook
It’s worth mentioning that the A17 Pro brings a 392,643-point CPU score and a 597,734-point outing for the GPU department. For reference, last year’s A16 Bionic chip managed a 1,474,011 score while the Apple M1 chip found on Apple laptops and iPads is just a hair away at 1,754,456 points.
Earlier, Samsung released The Freestyle 2nd Gen which makes imagination a reality. Recently, Samsung interviewed key players of The Freestyle 2nd Gen development, including Wonki Kim from the Lifestyle Team, Seongwon Seo from the Picture Quality Solution Lab, and TJ Kim from the Future Planning Group.
Smart Edge Blending is one of the biggest upgrades in The Freestyle 2nd Gen.
Smart Edge Blending seamlessly merges projections from two The Freestyle devices to create a large screen for pictures and videos. By connecting the two devices to the SmartThings app and synchronizing the video output with a photo of the projected screens, users can enjoy a full-screen experience from anywhere.
Follow our socials → Google News, Telegram, X (formerly Twitter), Facebook
Gaming through Samsung Gaming Hub
Through Samsung Gaming Hub, The Freestyle 2nd Gen supports gaming — a content form that was once unimaginable to enjoy on a portable projector. The addition of Samsung’s cloud gaming platform frees users from the limitations of consoles, wires and fixed screens such as smart TVs and monitors.
Screens Everywhere as a strategy
With the vision of “Screens Everywhere, Screens for All, The Freestyle 2nd Gen prioritizes portability and mobility to enable users to experience the benefits of a movable screen. Samsung’s goal is to move beyond simply targeting the existing market and present a new screen experience for everyone.
Recent developments suggest that Samsung is all set to ship the Galaxy S24 series with Exynos chip in select regions. However, the latest information talks about Galaxy S24’s Exynos chip’s mass production timing and packaging technology.
According to tipster Revegnus, Samsung is planning to produce an Exynos 2400 processor on FO-WLP packaging technology. It will be the first time the company will use this process for the production of Exynos smartphone chipsets.
Follow our socials → Google News, Telegram, X (formerly Twitter), Facebook
The source also revealed that the Galaxy S24 series is scheduled for early 2024 release. Meanwhile, the mass production of its Exynos 2400 chipset could start in the fourth quarter of this year, utilizing the Fan-out wafer-level packaging technology.
FO-WLP
Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions. [Source]