According to the report, BOE got Apple’s notification regarding the certification of the iPhone 14 OLED panels. The Chinese display maker will start mass production in July, while shipments are likely to begin in September.
Apple certified BOE displays for iPhone 14 earlier compared to the iPhone 12 and iPhone 13 series devices. Therefore, it looks like the company could launch the upcoming iPhone lineup earlier than its predecessor.
Recently, a TheElec report revealed that Apple and BOE will start evaluating OLED samples of the iPhone 14, while the former might give approval at the end of June 2022.
In September, Apple is expected to introduce the iPhone 14, 14 Pro 14 Max/Pro and 14 Pro Max. However, only the standard iPhone 14 model will feature an OLED display made by BOE, while others will pack Samsung’s.
Ahead of the iPhone 14 series, Samsung is going to introduce its futuristic next gen foldable displays that will debut with the Galaxy Z Fold 4 and Galaxy Z Flip 4 smartphones. Also, reports are there that the company might be launching a $800 foldable in the coming months.
Apple’s A17 Pro is one speedy chipset: How it fare on AnTuTu?
Apple’s iPhone 15 Pro and iPhone 15 Pro Max are equipped with an A17 Pro chipset, manufactured on TSMC’s 3nm process tech. It became the most powerful smartphone chip on Geekbench, following its debut. Notably, Apple’s A17 Pro used in the iPhone 15 Pro is one of the fastest phones on AnTuTu.
According to the info, the A17 Pro inside the iPhone 15 Pro and 15 Pro Max is one of the fastest phones on AnTuTu with a combined score of 1,641,883 points. This score surpasses the Android-leading nubia Red Magic 8 Pro+ which scores 1,632,859 points.
It’s worth mentioning that the A17 Pro brings a 392,643-point CPU score and a 597,734-point outing for the GPU department. For reference, last year’s A16 Bionic chip managed a 1,474,011 score while the Apple M1 chip found on Apple laptops and iPads is just a hair away at 1,754,456 points.
Samsung Experts Share Insights on The Freestyle 2nd Gen Development
Earlier, Samsung released The Freestyle 2nd Gen which makes imagination a reality. Recently, Samsung interviewed key players of The Freestyle 2nd Gen development, including Wonki Kim from the Lifestyle Team, Seongwon Seo from the Picture Quality Solution Lab, and TJ Kim from the Future Planning Group.
Smart Edge Blending is one of the biggest upgrades in The Freestyle 2nd Gen.
Smart Edge Blending seamlessly merges projections from two The Freestyle devices to create a large screen for pictures and videos. By connecting the two devices to the SmartThings app and synchronizing the video output with a photo of the projected screens, users can enjoy a full-screen experience from anywhere.
Gaming through Samsung Gaming Hub
Through Samsung Gaming Hub, The Freestyle 2nd Gen supports gaming — a content form that was once unimaginable to enjoy on a portable projector. The addition of Samsung’s cloud gaming platform frees users from the limitations of consoles, wires and fixed screens such as smart TVs and monitors.
Screens Everywhere as a strategy
With the vision of “Screens Everywhere, Screens for All, The Freestyle 2nd Gen prioritizes portability and mobility to enable users to experience the benefits of a movable screen. Samsung’s goal is to move beyond simply targeting the existing market and present a new screen experience for everyone.
Samsung Galaxy S24’s Exynos chip to use FO-WLP tech, production to begin in Q4 2023
Recent developments suggest that Samsung is all set to ship the Galaxy S24 series with Exynos chip in select regions. However, the latest information talks about Galaxy S24’s Exynos chip’s mass production timing and packaging technology.
According to tipster Revegnus, Samsung is planning to produce an Exynos 2400 processor on FO-WLP packaging technology. It will be the first time the company will use this process for the production of Exynos smartphone chipsets.
The source also revealed that the Galaxy S24 series is scheduled for early 2024 release. Meanwhile, the mass production of its Exynos 2400 chipset could start in the fourth quarter of this year, utilizing the Fan-out wafer-level packaging technology.
Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions. [Source]