Phones
Samsung Galaxy Z Flip 3 with Snapdragon 888, 8GB RAM spotted on Geekbench
Samsung will announce the Galaxy Z Fold 3 and Galaxy Z Flip 3 foldable smartphones at the next Unpacked event this August. Ahead of the official launch, the company’s upcoming clamshell-type foldable phone has been spotted on Geekbench that reveals some important details.
According to Geekbench, the Galaxy Z Flip 3’s US variant bears model number SM-F711U. In addition, the listing mentions Lahaina as the name of the motherboard, which is the codename for Qualcomm’s Snapdragon 888 processor.
Apart from this, the document also revealed that the device’s one variant will be available with 8GB RAM. With the flagship processor and higher RAM installation, we can surely expect a flagship-grade performance from the upcoming Galaxy Z Flip 3 folding smartphone.
Galaxy Z Fold 3 Geekbench
A few days ago, Samsung’s next Galaxy Fold had also spotted on Geekbench that confirmed that this device will be powered by the Snapdragon 888 instead of its overclocked version i.e. the Snapdragon 888 Plus. The listing also suggested that the device will be available in a 12GB RAM variant.
Galaxy Z Flip 3 Specs [Rumored]
Just recently, the Galaxy Z Flip 3 had appeared on China’s TENAA certification site that revealed its model number is SM-F7110 and measures 166 x 72.2 x 7.3mm while unfolded condition. The device will be 1.4mm narrower and 1.3mm shorter than the original Galaxy Z Flip smartphone,
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In terms of optics, it will have two 12MP rear cameras in a new and unique design, a 3,200mAh battery with 15W fast charging, GPS, 5G, Bluetooth 5.0, NFC, Wi-Fi 6, eSIM, USB Type-C port, and more. Furthermore, the upcoming clamshell-type folding phone will be introduced alongside the Galaxy Z Fold 3 on August 11.
The US variant of Samsung Galaxy Z Flip 6 will be equipped with a Snapdragon 8 Gen 3 processor. There were reports that Samsung may expand the Exynos chipset to its foldable lineup, which doesn’t seem to be happening, at least in the United States.
Recently, Samsung Galaxy Z Flip 6 US variant was spotted on Geekbench with Snapdragon chip. It isn’t surprising as the company is following its conventional chipset strategy. We expect that it will be the same chipset used in the Galaxy S24 Ultra, the Snapdragon 8 Gen 3 for Galaxy.
The Flip 6 smartphone scored 15084 points on Geekbench’s GPU test. Due to its foldable form factor, the device may miss a Galaxy S24-like larger cooling technology. Still, its impressive 15000+ points in the GPU test indicates that Samsung has greatly optimized the software.
The company still has three months remaining in the launch event. More performance improvements will likely be achieved before the Unpacked. The South Korean tech giant will likely unveil the next-gen foldable phones in mid-July.
This year, the Galaxy Z Fold 6 Ultra would join the standard Galaxy Z Fold 6 and the Galaxy Z Flip 6. In addition, an affordable variant of Fan Edition branding is also in development. However, the cheaper foldable would miss some pro-grade specs to maintain the price.
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Samsung seems all set to introduce Galaxy M35 5G in India. The phone has surfaced on Samsung India support website and the FCC and Dekra certification database. The development indicates that the official launch is not far away, at least in India.
The unreleased Galaxy M35 5G made its first appearance on the Samsung India support website. The listing revealed nothing other than the phone’s model number – SM-M356B. As spotted by 91mobiles, the upcoming handset has also received certification from FCC and Dekra.
Listing on the FCC database revealed that the Galaxy M35 5G features NFC, LTE, and 5G. It’s also confirmed that the device supports 25W fast charging, lagging behind its elder brother – Galaxy M55 5G, which supports fast charging up to 45W.
Dekra certification disclosed that the phone packs a 5880mAh battery, which Samsung will market as 6000mAh. Other features could include Android 14 OS out-of-the-box, Exynos 1380 chipset paired with 6GB of RAM as well as a modern punch hole display.
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Google‘s Pixel 9 series is ready to introduce a significant upgrade with emergency satellite connectivity and new Samsung modem. This series aims to solve the persistent connectivity problems seen in previous Pixel models.
According to the information via AndroidAuthority, Samsung Modem 5400 will be integrated with Tensor G4 chips for the Pixel 9 series to bring significant improvements in terms of speed, power efficiency, and stability
The Pixel 9’s modem will support 5G non-terrestrial networks (NTN), which means it will enable satellite-based communication. This is particularly important for emergencies where standard network coverage is unavailable.
Moreover, this innovative feature is not exclusive to the Pixel 9. The next-generation Pixel Fold and a 5G tablet, currently under development, will also be equipped with the same modem.
One of the most notable features of this upgrade is the ability to connect with emergency services via satellite, which is crucial for users in areas without cellular coverage. To facilitate this, Google has implemented a system that guides users through a set of questions, allowing for quick communication with emergency responders. For example,
- What happened?
- [Are you/Are they/Is everyone] breathing?
- In total, how many people are [missing/trapped]?
- What best describes your situation?
- What is on fire?
- Are there weapons involved?
Although the release details for the 5G tablet are still unclear, the Pixel 9 series is expected to lead the way in mobile communication technology, ensuring users can remain connected in any location.
Google Pixel 9 renders reveal design overhaul, telephoto camera
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