Samsung will announce the Galaxy Z Fold 3 and Galaxy Z Flip 3 foldable smartphones at the next Unpacked event this August. Ahead of the official launch, the company’s upcoming clamshell-type foldable phone has been spotted on Geekbench that reveals some important details.
According to Geekbench, the Galaxy Z Flip 3’s US variant bears model number SM-F711U. In addition, the listing mentions Lahaina as the name of the motherboard, which is the codename for Qualcomm’s Snapdragon 888 processor.
Apart from this, the document also revealed that the device’s one variant will be available with 8GB RAM. With the flagship processor and higher RAM installation, we can surely expect a flagship-grade performance from the upcoming Galaxy Z Flip 3 folding smartphone.
Galaxy Z Fold 3 Geekbench
A few days ago, Samsung’s next Galaxy Fold had also spotted on Geekbench that confirmed that this device will be powered by the Snapdragon 888 instead of its overclocked version i.e. the Snapdragon 888 Plus. The listing also suggested that the device will be available in a 12GB RAM variant.
Galaxy Z Flip 3 Specs [Rumored]
Just recently, the Galaxy Z Flip 3 had appeared on China’s TENAA certification site that revealed its model number is SM-F7110 and measures 166 x 72.2 x 7.3mm while unfolded condition. The device will be 1.4mm narrower and 1.3mm shorter than the original Galaxy Z Flip smartphone,
In terms of optics, it will have two 12MP rear cameras in a new and unique design, a 3,200mAh battery with 15W fast charging, GPS, 5G, Bluetooth 5.0, NFC, Wi-Fi 6, eSIM, USB Type-C port, and more. Furthermore, the upcoming clamshell-type folding phone will be introduced alongside the Galaxy Z Fold 3 on August 11.